CHIPSEN BoT-cDA110DS Bluetooth v5.1 SPP Class2 (+4dBm) DIP + SMA Antenna

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The CHIPSEN BoT-cDA110DS module features a BoT-cDA110SC SPP Bluetooth module mounted on a DIP carrier with 2.54mm headers pins and as SMA antenna connector (the antenna is not included). This module can be installed in through-hole PCBs, mounted in 2.54mm sockets for easy removal, or can be plugged into the CHIPSEN BoT-USB-TB Test Board to easily connect the module to a PC's USB port. 

The BoT-cDA110DS Serial Port Profile (SPP) Bluetooth module is a cost-effective, true system-on-chip (SoC) for classic Bluetooth applications. It complies with Bluetooth specification version 5.1 and integrates the RF and Baseband controller in a small package. This Bluetooth module has deployed MCU with Bluetooth function included chipset.

BoT-cDA110DS Features

• BT Version: Complies with Bluetooth Core Specification v5.1
• SMA Antenna Connector (Antenna is not included)
• Supports Basic Rate (BR), Enhanced Data Rate (EDR) 2&3 Mbps
• TX RF Power: 4dBm
• RX sensitivity: -91dBm(BR)
• 96-MHz Arm Cortex-M4 microcontroller unit MCU
• 1MB Flash, 512KB RAM
• 1x peripheral UART
• Hardware security engine
• 16 GPIOs
• Wide operating voltage range: 2.7V to 3.6V
• Operating temperature range (-30℃ ~ 85℃)
• Size: 24mm x 22mm x 11 mm (including the header pins)
• Certifications: SIG, KC (including wireless EMC), FCC, CE RED with ROHs, TELEC

Applications

• Bluetooth data communication
• Laptop / Handheld Device
• Bluetooth access point
• Industrial automation
• Remote meter reading system
• POS / Mobile printer

BoT-cDA110DS Bluetooth SPP DIP Module mounted on a BoT-USB-TB Test Board:

Documentation and Downloads

BoT-cDA110SC/SU Datasheet and Installation Documentation (PDF)

BoT-cDA110DC/DU Dimensions and Mechanical Specifications (PDF)

BoT-cDA110 FCC Certification (PDF)

BoT-cDA110 CE RED Certification (PDF)