CHIPSEN BoT-TMA50D Bluetooth v5.3 BLE Class1 (+20dBm) DIP Slave/Master/Multicon 1:8 Module w/ Chip Antenna

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The CHIPSEN BoT-TMA50D module features a BoT-TMA50 SMD Master/Slave/Multicon Long-Distance Bluetooth BLE module mounted on a DIP carrier with 2.54mm header pins. This module can be installed in through-hole PCBs, mounted in 2.54mm sockets for easy removal, or can be plugged into the CHIPSEN BoT-USB-TB Test Board to easily connect the module to a PC's USB port. 

The electrical and performance specifications for this module are the same as the BoT-TMA50. See the BoT-TMA50 OEM Long-Distance Bluetooth module product page for full specifications.

BoT-TMA50D Features

• Bluetooth Processor: BoT-TMA50 (Master, Slave or Multicon Mode)
• BT Version: Bluetooth Low Energy (BLE) V5.3
• Built in Antenna Bluetooth Smart (Bluetooth Low Energy) Module
• ARM® Cortex® M4 32 bit processor with FPU, 64 MHz
• Memory: 512 kB Flash / 128 kB RAM
• RF Output Power: up to 20 dBm E.I.R.
• RF Receive Sensitivity: -98.0 dBm w/ Dirty Tx enabled, 1Mbps Bluetooth Low Energy mode
• On chip LDO system
• Temperature Sensor on chip
• UART (CTS/RTS) with EasyDMA, SPI, and I2C data interfaces
• 12 Bit 200 ksps ADC with 7 configurable channels with programmable gain
• Size: 24 mm x 22 mm x 12.2 mm (including pins)
• Operating Voltage: 2.7 V to 3.6V
• Operating Temperature: -40℃ to +85℃ (FCC, JAPAN, KC) / -20℃ to +85℃ (CE Only)
• Certifications: SIG, KC (including wireless EMC), FCC, CE, TELEC
  

BoT-TMA50D Header Pins and Pinout

The BoT-TMA50D is supplied with unsoldered 2.54mm header pins. The board can be wired into the circuit through the connection pads, or the header pins can be soldered in to plug the board into another PCB, plugged into a BoT-USB-TB Test Board. 

Documentation and Downloads

BoT-TMA50 Datasheet, Dimensions and Installation Documentation (PDF)

BoT-TMA50D/DU Dimensions and Mechanical Specifications (PDF)