CHIPSEN BoT-nLE523D Bluetooth v5.3 BLE Class1.5 (+7dBm) DIP Slave Module w/ Chip Antenna

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The CHIPSEN BoT-nLE523D module features a BoT-nLE523 SMD master/slave Bluetooth module mounted on a DIP carrier with 2.54mm headers pins. This module can be installed in through-hole PCBs, mounted in 2.54mm sockets for easy removal, or can be plugged into the CHIPSEN BoT-USB-TB Test Board to easily connect the module to a PC's USB port. 

The electrical and performance specifications for this module are the same as the BoT-nLE523. See the BoT-nLE523 OEM Bluetooth module product page for full specifications.

BoT-nLE523D Features

• Bluetooth Processor: BoT-nLE523 (Master or Slave Mode)
• BT Version: Bluetooth Low Energy (BLE) V5 .3
• Built in Antenna Bluetooth Smart (Bluetooth Low Energy) Module
• ARM® Cortex® M4 32 bit processor with FPU, 64 MHz
• Memory: 512 kB Flash / 128 kB RAM
• RF Output Power: MAX + 7 dBm ( 20 ~ 7 dBm)
• RF Receive Sensitivity: -93.5 dBm w/ Dirty Tx enable, 1Mbps Bluetooth Low Energy mode
• Type 2 near field communication (NFC A) tag with wakeup on field and touch to pair capabilities
• On chip LDO and DC/DC converter system (Used LDO by Default)
• Temperature Sensor
• UART (CTS/RTS) with EasyDMA, SPI, and I2C data interfaces
• 12 Bit 200 ksps ADC with 7 configurable channels with programmable gain
• Size: 15 mm x 8 mm x 1.8 mm
• Operating Voltage: 2 7 V to 3. 6V
• Operating Temperature: -40 to +85℃
• RoHS compliant
• Certifications: SIG, KC (including wireless EMC), FCC, CE, TELEC
  

BoT-nLE523D Header Pins and Pinout

The BoT-nLE523D is supplied with unsoldered 2.54mm header pins. The board can be wired into the circuit through the connection pads, or the header pins can be soldered in to plug the board into another PCB, plugged into a BoT-USB-TB Test Board. 

Documentation and Downloads

BoT-nLE523 Datasheet and Installation Documentation (PDF)